- Jan / 2010
- Established WUHAN CHENGSHUO SOFTWARE DEVELOPMENT
CORPORATION (100% subsidiary) in China
- Nov / 2009
- Capital was raised up to 9,485.92 million yen
- Nov / 2009
- Listed on the Tokyo Stock Exchange Mothers market
- Jul / 2009
- Capital was raised up to 6,846.67 million yen
- Aug / 2008
- Capital was raised up to 6,009.35 million yen
- May / 2008
- Launch the sale of "Cygnus" series (Etching System for 300mm Wafer)
- Jan / 2007
- Launch the sale of "XORS" series (Surface Oxynitridation System)
- Dec / 2006
- Capital was raised up to 5,065.12 million yen
- Oct / 2006
- Established FOI TECHNOLOGIES CORPORATION (100% subsidiary) in USA
- May / 2006
- Launch the sale of "GARUDA" series (Light Etching System for 300mm Wafer)
- Nov / 2005
- Launch the sale of "Rydeen-7000" series (Ashing System for 300mm Wafer)
- Oct / 2005
- Launch the sale of "STELLA" series (Etching System for 300mm Wafer)
- Jun / 2005
- Launch the sale of "Rydeen-6000" series (Light Etching System for 200mm Wafer)
- May / 2005
- Launch the sale of "Rydeen-5000" series (Ashing System for 200mm Wafer)
- Apr / 2005
- Launch the sale of "Rydeen-10000" series (Light Etching System for 300mm Wafer)
- Feb / 2005
- Launch the sale of "SE-1000" series (Etching System for 150/200mm Wafer)
- Jan / 2005
- Integrated Machida technology center into Sagamihara technology center
- Nov / 2004
- Relocated our headquarters to Sagamihara and Established technology center in there
- Oct / 2004
- Established FOI KOREA CORPORATION (100% subsidiary) in Korea
- Jul / 2004
- Capital was raised up to 3,066.9 million yen
- Mar / 2004
- Established Machida technology center in Tokyo
- Aug / 2003
- Capital was raised up to 1,427 million yen
- May / 2003
- Capital was raised up to 1,363.5 million yen
- Apr / 2003
- Launch the sale of "SE-4000" series (Etching System for 300mm Wafer)
- May / 2002
- Established FOI TAIWAN CORPORATION (100% subsidiary) in Taiwan
- Mar / 2002
- Capital was raised up to 895.5 million yen
- Dec / 2000
- Capital was raised up to 645.5 million yen
- Dec / 2000
- Launch the sale of "SE-3000" series (Etching System for 300mm Wafer)
- Nov / 2000
- Relocated our headquarters to Kakio and Established technology center in there
- Jun / 2000
- Launch the sale of "VA-1000" (Microwave Plasma Ashing System for 4~8 inch Wafer)
- Dec / 1999
- Launch the sale of "VA-3000" (Microwave Plasma Ashing System for 300mm Wafer)
- Dec / 1998
- Capital was raised up to 145.5 million yen
- Aug / 1998
- Launch the sale of "VA-2000" (Microwave Plasma Ashing System for 200mm Wafer)
- Aug / 1998
- Capital was raised up to 55.5 million yen
- Jul / 1998
- Capital was raised up to 40 million yen
- Mar / 1997
- Started to develop dielectric etching system for 300mm wafer, jointly developed with KOBELCO
- Apr / 1996
- Took authorization of the medium and small-sized business creation activity promotion law in Japan
- Aug / 1995
- Released FR-J1 type Clean Robot
- Mar / 1995
- Released MN-Z type Manual Prober
- Oct / 1994
- Established FOI CORPORATION with 10 million yen in capital at Kanagawa Science Park
