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Light Etching System- Rydeen-6800 is a light etching system for 150/200mm wafer which has Balanced-ICP source & cathode bias (RIE), based on Rydeen-5200 which is an ashing system using advanced technology of FOI.
It has the fastest throughput in the world (over 210 wafers/hour (mechanical)), and combines high density Balanced-ICP source with low-temperature cathode stage & RF bias which are used by FOI etching systems with a proven track record of experiences.
Therefore, Rydeen-6800 can be applied to the latest various processes, such as light etching for bumping process, forming photoresist of image sensor device, forming plastic lens, photoresist etching on Cu wiring, and Low-k film etching, etc.
Rydeen-6800 fully supports FA (GEM).
Rydeen-10000 is a light etching system for 200/300mm wafer which has Balanced-ICP source & cathode bias (RIE), based on Rydeen-5200 which is an ashing system using advanced technology of FOI.
It has the fastest throughput in the world (over 210 wafers/hour (mechanical)), and combines high density Balanced-ICP source with low-temperature cathode stage & RF bias which are used by FOI etching systems with a proven track record of experiences.
Therefore, Rydeen-10000 can be applied to the latest various processes, such as light etching for bumping process, forming photoresist of image sensor device, forming plastic lens, photoresist etching on Cu wiring, and Low-k film etching, etc.
Rydeen-10000 fully supports FA (GEM, GEM300).
