• Ashing System
  • Rydeen-5200 is an ashing system for 150/200mm wafer, using advanced technology of FOI.


    It has the fastest throughput in the world (over 210 wafers/hour (mechanical)).


    In combination with high density Balanced-ICP source, Rydeen-5200 can achieve over 200 wafers/hour at normal ashing process using FOI standard photoresist wafer.


    Even at high dose ion-implanted photoresist, it can achieve high throughput.


    Rydeen-5200 fully supports FA (GEM).


    Rydeen-7000 is an ashing system for 300mm wafer, using advanced technology of FOI.


    Rydeen-7000 has the astounding throughput (over 210 wafers/hour (mechanical)) as a system for 300mm wafer, by use of the smallest & fastest transfer system (FOI original) in the world.


    In combination with high density Balanced-ICP source, Rydeen-7000 can achieve over 200 wafers/hour at normal ashing process using FOI standard photoresist wafer.


    Even at high dose ion-implanted photoresist, it can achieve high throughput.


    Rydeen-7000 fully supports FA (GEM, GEM300).